162: Principles of MEMS

نویسنده

  • Janusz Bryzek
چکیده

MEMS is an acronym for Microelectro Mechanical Systems, it defines mechanical structures fabricated with IC processing on (most often) silicon wafers. In Europe, MEMS is labeled Microsystems and in Japan it is labeled Micromachines. The term MEMS evolved in the United States in the 1990s. Prior to that period the technology was labeled silicon micromachining . MEMS defines the technology; not specific products. This technology encompasses a collection of a variety of processes enabling three-dimensional shaping of wafers or stacks of wafers. While most of the applications use silicon wafers, many other materials have been used, including glass and quartz wafers. As a result of batch manufacturing technology (using multiple devices photolithographically defined on a wafer), the cost of the single device depends on its size; wafer processing cost is fixed for a given process. The cost difference between a 1 × 1 mm device and a 10 × 10 mm device is 100 times, as the first device would yield about 16 000 devices on a 6-in diameter wafer, and the larger device would yield only about 160 devices on the same wafer. The beginning of MEMS technology dates back to the discovery of semiconductors at Bell Laboratories in the early 1950s. Many consider their 1954 paper, announcing the discovery of piezoresistive effect in silicon and germanium, as the birth date of MEMS. A related acronym MOEMS stands for Micro Opto Electro Mechanical Systems and defines a subset of MEMS, that is, devices performing optical functions.

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تاریخ انتشار 2004